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ABB Switzerland Ltd. Enhances Power Electronics with Icepak Software
Technology Category
- Analytics & Modeling - Predictive Analytics
- Sensors - Environmental Sensors
Applicable Industries
- Electronics
- Semiconductors
Applicable Functions
- Product Research & Development
Use Cases
- Autonomous Robots
- Movement Prediction
Services
- System Integration
The Challenge
ABB Switzerland Ltd., a global leader in power and automation technology, faced a significant challenge with their HiPak modules. These modules, used in a variety of applications from traction converters to motor drives, required different cooling systems to remove the heat dissipated by the insulated gate bipolar transistors (IGBT) and diodes. The cooling systems varied substantially, making it crucial for ABB to predict the maximum package temperature to ensure reliability and proper functionality. The challenge was to find a solution that could accurately predict the temperature field of the coupled HiPak module–heat exchanger system and provide a reliable means to find the optimal heat exchanger configuration.
About The Customer
ABB Switzerland Ltd. is a world leader in power and automation technology. The company's product portfolio includes electric motors, drives, converters, circuit breakers, robots, semiconductors, sensors, and more. These products are used in a wide range of applications, from large industrial applications such as paper mills, trains, ships, and car assembly lines, to small domestic ones like wall switches and circuit breakers. The ABB Group operates in approximately 100 countries and employs about 108,000 people. The company is known for its HiPak modules, which are used in a variety of applications, from traction converters to motor drives.
The Solution
ABB Switzerland Ltd. turned to Icepak software to solve their challenge. The software allowed the prediction of the entire temperature field of the coupled HiPak module–heat exchanger system. It provided a quick and reliable means to find the optimal heat exchanger configuration. Beyond this, Icepak was also used in the thermal design and analysis of many other ABB products, ranging from power electronics modules to complete control cabinets for robots. The software enabled the prediction of the effects of modifications to the HiPak module, such as the use of new materials or components. It also offered the possibility of running parametric calculations, providing a very quick way to gain insight on the effect and importance of the system key design parameters.
Operational Impact
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