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TE Connectivity
TE Connectivity is a $12 billion global technology leader. Our connectivity and sensor solutions are essential in today’s increasingly connected world. We collaborate with engineers to transform their concepts into creations – redefining what’s possible using intelligent, efficient and high-performing TE products and solutions proven in harsh environments. Our 72,000 people, including over 7,000 engineers, partner with customers in close to 150 countries across a wide range of industries.
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Switzerland 2007 Private > $10b > 50,000 Open website - TECHNOLOGY STACK
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TE Connectivity’s Tech Stack maps TE Connectivity’s participation in the IoT tech stack.
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Application Layer
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Functional Applications
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Cloud Layer
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Platform as a ServiceInfrastructure as a Service
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Edge Layer
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Automation & ControlProcessors & Edge IntelligenceActuatorsSensors
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Devices Layer
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RobotsDronesWearables
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Supporting
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Analytics & ModelingApplication Infrastructure & MiddlewareCybersecurity & PrivacyNetworks & Connectivity
Technological CapabilityNoneMinorModerateStrong -
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TE Connectivity’s IoT Snapshot maps the range and focus areas of TE Connectivity’s IoT business across Technologies, Use Cases, Industries, and Services. Only categories with active products will be shown. Missing categories indicate that there is no activity in those areas.TechnologiesSensorsAccelerometersAirflow SensorsFlow MetersHumidity SensorsLevel SensorsOptical SensorsPressure SensorsProximity SensorsTemperature SensorsVibration Sensors
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- KEY CUSTOMERS
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- CASE STUDIES
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TE Connectivity: IIC Smart Manufacturing Connectivity for Brown-field SensorsThe discrete manufacturing domain is characterized by a strictly hierarchical structure of the automation systems, commonly referred to as the automation pyramid. Data acquired by a sensor typically flows through an IO-module into a Programmable Logic Controller (PLC) which manages the local real-time control system. As all process data are concentrated in the PLC, re-programming the PLC and thus, implementing interfaces to access these data appear to be the natural choice to transfer them to the IT system. However, for brownfield installations this choice has proven impracticable for the following two reasons:In brownfield facilities, PLC usually operate within a once-specified environment and are rarely re-programmed. That is why the active staff is often not familiar with the code and lacks of the competence to modify the existing implementation in a reasonable amount of time.Furthermore, for cost reasons, any PLC was selected to exactly match the requirements of the environment within which it was intended to operate. That is why it cannot be assumed that a PLC will be able to support additional tasks such as communicating data through additional interfaces.
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- PODCASTS
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IIC x IoT ONE IIoT Spotlight Podcast EP039: How to ensure connectivity for brownfield sensors - An Interview with Michael Hilgner of TE ConnectivityWednesday, Oct 10, 2018
*This episode of the Industrial IoT Spotlight Podcast is sponsored by the Industrial Internet ConsortiumWe discuss the IIC test bed for smart manufacturing connectivity for brownfield sensors.What are the key challenges to implementing IoT sensors and technologies in brownfield environments? How can we ensure that all technologies and business processes have interoperability with each other? How will communication standards evolve in the industry in the future?Michael Hilgner of TE Connectivity explains to us the challenges and best practices of implementing connected sensors in a brownfield environment.Dr. Michael Hilgner has engaged himself in communication infrastructure and high-frequency components design in diverse roles throughout his career. In his current role as Manager Consortia & Standards at TE Connectivity’s Industrial Business Unit, he provides his experience to international standardization activities and industrial user groups in the areas of industrial networks, fieldbuses and cabling systems. In addition to his engagement at IIC where he leads the Smart Manufacturing Connectivity for Brown-field Sensors Testbed, Michael contributes to several Industrie 4.0 working groups to detail I4.0 requirements and technologies for active and passive infrastructure components." /> - MEMBERSHIP
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IO-LinkIO-Link is a fieldbus independent and manufacturer independent communication standard and can be integrated into any existing fieldbus via a corresponding interface. This fieldbus independence allowed the creation of a corresponding specification by the IO-Link community, which has already been published by the IEC (International Electrotechnical Commission) as IEC 61131-9 (International Standard).Industrial Internet Consortium (IIC)Accelerate the growth of the industrial internet by identifying, assembling, testing and promoting best practices.
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- SIMILAR SUPPLIERS
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HoneywellHoneywell invents and manufactures technologies to address some of the world’s toughest challenges initiated by revolutionary macrotrends in science, technology and society. They improves business performance for customers with automation and control solutions, equipment and services that enhance safety, reliability and efficiency. Year founded: 1906 Revenue: $40.3 billion (2014) NYSE: HONRockwell AutomationRockwell is a provider of industrial automation power, control and information solutions that helps manufacturers achieve a competitive advantage for their businesses. Rockwell operates in two segments: Architecture & Software, which deals in hardware, software and communication components of the organization, and Controls Products & Solutions that handles a portfolio of intelligent motor control and industrial control products, application expertise and project management capabilities.TDKTDK Corporation is a leading electronics company based in Tokyo, Japan. It was established in 1935 to commercialize ferrite, a key material in electronic and magnetic products. TDK's portfolio includes electronic components, modules and systems marketed under the product brands TDK and EPCOS, power supplies, magnetic application products as well as energy devices, flash memory application devices, and others.
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