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Zyvex Corporation: Pioneering 3D MEMS Technology for Nanotech Applications
Technology Category
- Sensors - Accelerometers
- Sensors - Acoustic Sensors
Applicable Industries
- Electronics
- Equipment & Machinery
Applicable Functions
- Product Research & Development
Use Cases
- Mesh Networks
- Virtual Prototyping & Product Testing
Services
- Hardware Design & Engineering Services
- System Integration
The Challenge
Zyvex Corporation, a leading molecular nanotechnology development company, was faced with the challenge of developing micro-electro-mechanical systems (MEMS) technology that could enable new nanotech applications. The majority of commercially available MEMS devices were essentially two-dimensional, grown onto or etched from a flat substrate. However, Zyvex saw the potential for MEMS technology that provided structures and devices with 3D characteristics. The challenge lay in the manufacturing process. Building a 3D MEMS device required some form of assembly to raise structures from the plane of fabrication and move them into the appropriate position. Conventional assembly methods were costly and alternative methods had limitations. Furthermore, the use of computational analysis was critical to the design of microstructures, as a microfabrication cycle could take up to four months.
About The Customer
Zyvex Corporation, based in Richardson, TX, is the first molecular nanotechnology development company and an aggressive developer of commercial nanotech applications. The company has three product lines – materials, tools, and structures – and is focused on three market segments: aerospace and defense; healthcare and medicine; and electronics and semiconductors. Zyvex customers include industry leaders such as Boeing, Easton Sports, Honeywell International, and Texas Instruments. The company is active in several areas of research, funded by grants from state and federal agencies.
The Solution
Zyvex Corporation developed a unique approach to overcome these challenges. They designed compliant MEMS components that could be de-tethered, removed from the plane of the wafer, and assembled, all in an automated process. This was achieved through a directed pick-and-place microassembly process using MEMS end-effectors and high-precision robotics. This made it possible to integrate microcomponents that had been fabricated in separate processes. Zyvex also heavily relied on finite-element analysis (FEA) tools in their MEMS design process. These tools allowed them to design, analyze, and test MEMS structures, accelerating their work significantly. They used advanced FEA tools like Altair HyperMesh for more control over the mesh densities and visualization capabilities of post-processing tools like Altair HyperView for understanding the performance and function of MEMS devices.
Operational Impact
Quantitative Benefit
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