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Terepac
为世界发声
概述
公司介绍
Terepac 成立于 2004 年，旨在将突破性创新商业化，通过全新的电子产品组装、集成和包装范例克服这些限制。该公司的革命性技术使复杂的微电子器件能够以创建传统电路的一小部分尺寸和成本印刷在柔性基板上。带有微处理器、内存和传感器的整个设备可以缩小到不到一平方毫米，比纸还薄，并且足够灵活，可以绕着铅笔弯曲——而不会牺牲性能。
物联网应用简介
Terepac 是平台即服务 (paas), 和 应用基础设施与中间件等工业物联网科技方面的供应商。.
技术栈
Terepac的技术栈描绘了Terepac在平台即服务 (paas), 和 应用基础设施与中间件等物联网技术方面的实践。
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设备层
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边缘层
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云层
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应用层
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配套技术
技术能力:
无
弱
中等
强
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